Method for manufacturing electronic component module and electronic component module

ABSTRACT

A method for producing an electronic component module prevents a space from collapsing. The method includes a step of preparing an electronic component including an element substrate, a drive device formed on a principal surface of the element substrate, and a protection device covering the drive device so as to form a space around the drive device; a step of fixing the electronic component on a common substrate such that a principal surface of the common substrate and another principal surface of the element substrate face each other; a step of fixing a reinforcing plate on the protection device of the electronic component; and a step of forming a resin layer on the principal surface of the common substrate such that the electronic component is contained therein.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an electronic component moduleincluding an electronic component, such as a SAW (surface acoustic wave)element or a BAW (bulk acoustic wave) element, contained in a resinlayer.

2. Description of the Related Art

As an electronic component such as an existing SAW (surface acousticwave) element or BAW (bulk acoustic wave) element, for example, anelectronic component described in Japanese Unexamined Patent ApplicationPublication No. 2009-159124 is known. In the electronic component, asshown in FIG. 6, a drive device 112 is provided on a piezoelectricsubstrate 110. In addition, vibration protection films 116 and 118 areformed around the drive device 112. The vibration protection films 116and 118 serve to protect the drive device 112.

Furthermore, a space 138 is formed by a protection device 130. The space138 is provided so as to ensure a space when an elastic wave or anacoustic wave propagates. The protection device 130 is composed of afirst protection film 132, a second protection film 134, and a thirdprotection film 136.

Meanwhile, when the electronic component in Japanese Unexamined PatentApplication Publication No. 2009-159124 is mounted, the space may becollapsed. In other words, when an electronic component module includingthe electronic component is produced, after the electronic component ismounted on a common substrate, a resin layer is formed so as to coverthe electronic component. When the resin layer is formed by means ofmolding, relatively-high pressure is applied to resin. Thus, dependingon the resin, there is a concern that the protection device is deformedand the space is collapsed.

SUMMARY OF THE INVENTION

In view of the above-described problems, preferred embodiments of thepresent invention provide a method for manufacturing an electroniccomponent module and an electronic component module in which a space isprevented from collapsing.

A method for manufacturing an electronic component module according to apreferred embodiment of the present invention includes a step ofpreparing an electronic component including an element substrate, adrive device located on a principal surface of the element substrate,and a protection device arranged to define a space around the drivedevice and covering the drive device; a step of preparing a commonsubstrate, and mounting and fixing the electronic component on thecommon substrate by using a mounter such that a principal surface of thecommon substrate and another principal surface of the element substrateface each other; a step of mounting and fixing a reinforcing plate onthe protection device of the electronic component by using a mounter;and a step of forming a resin layer on the principal surface of thecommon substrate such that the electronic component is containedtherein.

In the method for manufacturing the electronic component moduleaccording to a preferred embodiment of the present invention, in thestep of fixing the reinforcing plate, preferably, an adhesive layer ispreviously formed on a surface of the reinforcing plate, and thereinforcing plate is fixed such that the adhesive layer is locatedbetween the protection device and the reinforcing plate.

In the method for manufacturing the electronic component moduleaccording to a preferred embodiment of the present invention, thereinforcing plate is preferably made of Si.

In the method for manufacturing the electronic component moduleaccording to a preferred embodiment of the present invention,preferably, the element substrate is a piezoelectric substrate and thedrive device includes an interdigital transducer electrode.

In the method for manufacturing the electronic component moduleaccording to a preferred embodiment of the present invention,preferably, the element substrate is an insulating substrate and thedrive device includes a piezoelectric thin film on both surfaces ofwhich electrodes are formed.

In the method for manufacturing the electronic component moduleaccording to a preferred embodiment of the present invention,preferably, the element substrate is an insulating substrate and thedrive device includes a vibrating device made of Si.

According to another preferred embodiment of the present invention, anelectronic component module includes a common substrate; an electroniccomponent fixed on the common substrate, the electronic componentincluding an element substrate, a drive device located on a principalsurface of the element substrate, and a protection device arranged todefine a space around the drive device and covering the drive device,the electronic component being mounted and fixed by using a mounter suchthat a principal surface of the common substrate and another principalsurface of the element substrate face each other; a reinforcing platemounted and fixed on the protection device of the electronic componentby using a mounter; and a resin layer located on the principal surfaceof the common substrate so as to contain the electronic componenttherein.

In the electronic component module according to a preferred embodimentof the present invention, preferably, an adhesive layer is previouslyformed on the reinforcing plate and the reinforcing plate is fixed suchthat the adhesive layer is located between the protection device and thereinforcing plate.

In various preferred embodiments of the present invention, it ispossible to prevent collapse of the space due to the presence of thereinforcing plate.

The above and other elements, features, steps, characteristics andadvantages of the present invention will become more apparent from thefollowing detailed description of the preferred embodiments withreference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B are a top view and a cross-sectional view showing anelectronic component module according to a preferred embodiment of thepresent invention.

FIGS. 2A-2C are cross-sectional views showing a method for manufacturingthe electronic component module according to a preferred embodiment ofthe present invention.

FIG. 3D is a cross-sectional view showing the method for manufacturingthe electronic component module according to a preferred embodiment ofthe present invention and showing a continuation of FIGS. 2A-2C.

FIG. 4 is a cross-sectional view showing an electronic component used ina preferred embodiment of the present invention.

FIG. 5 is a cross-sectional view showing an electronic component used ina preferred embodiment of the present invention.

FIG. 6 is a cross-sectional view showing an existing electroniccomponent.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, preferred embodiments of the present invention will bedescribed.

First Preferred Embodiment

FIGS. 1A and 1B are a top view and a cross-sectional view showing anelectronic component module according to a preferred embodiment of thepresent invention. FIG. 1A is a top view, and FIG. 1B is an A-Across-sectional view of FIG. 1A.

An electronic component module 1 includes a common substrate 46, anelectronic component 10 a, and a resin layer 48. In the presentpreferred embodiment, the electronic component module 1 may include anIC element 30. The electronic component 10 a and the IC element 30 arefixed on the common substrate 46. In addition, the resin layer 48 isarranged on a principal surface of the common substrate 46 so as tocontain the electronic component 10 a and the IC element 30 therein.

The electronic component 10 a and the IC element 30 are electricallyconnected to lands 42 via wires 44. The lands 42 are provided toelectrically connect the electronic component module 1 to an externalcircuit, and at least some of the lands 42 are exposed on a bottomsurface of the electronic component module 1.

Next, a method for manufacturing the electronic component moduleaccording to a preferred embodiment of the present invention will bedescribed with reference to cross-sectional views of FIGS. 2A-2C and 3D.The present preferred embodiment is an example where the electroniccomponent 10 a is a SAW element.

First, as shown in FIG. 2A, the electronic component 10 a is prepared.The electronic component 10 a includes an element substrate 12, a drivedevice 16 a, a protection device 18, a wire 22 a, and a terminalelectrode 24.

In the present preferred embodiment, the element substrate 12 is apiezoelectric substrate. A surface acoustic wave propagates on a surfaceof the piezoelectric substrate. Examples of the material of thepiezoelectric substrate include LiTaO₃ and the like.

The drive device 16 a is located on a principal surface of the elementsubstrate 12. In addition, in the present preferred embodiment, thedrive device 16 a includes an interdigital transducer electrode.Examples of the material of the interdigital transducer electrodeinclude Al and the like.

The protection device 18 is arranged to define a space 14 around thedrive device 16 a, and covers the drive device 16 a. The protectiondevice 18 has, for example, a three-layer structure. In this case,first, a photosensitive polyimide resin is applied to the entirety of aprincipal surface of the piezoelectric substrate, such that a resin filmis provided. Next, of the resin film, a portion covering the drivedevice 16 a and the surrounding thereof is removed by aphotolithographic technique. Next, a composite layer of a photosensitivepolyimide resin and a sheet material is provided on the resin film.

The terminal electrode 24 is formed on the principal surface side of theelement substrate 12. In addition, the wire 22 a is provided so as toelectrically connect the drive device 16 a to the terminal electrode 24.It is preferred if the interdigital transducer electrode of the drivedevice 16 a and the wire 22 a are formed by the same process, since itis possible to produce them at a low cost. Examples of a method forforming the interdigital transducer electrode and the wire 22 a includemethods using a thin film process such as a sputtering method.

Next, as shown in FIG. 2B, the common substrate 46 is prepared, and theelectronic component 10 a is fixed on the principal surface of thecommon substrate 46. At that time, the electronic component 10 a isfixed such that the principal surface of the common substrate 46 andanother principal surface of the element substrate 12 face each other.First, the electronic component 10 a is mounted on the common substrate46 by using a mounter. At that time, the mounter retains the electroniccomponent 10 a that is previously disposed at a predetermined location,with a suction mechanism or the like. Then, the mounter transfers theelectronic component 10 a onto the common substrate 46 in a state ofretaining the electronic component 10 a. Then, the mounter releases theretention of the electronic component 10 a and mounts the electroniccomponent 10 a on the common substrate 46.

If an adhesive layer is interposed between the common substrate 46 andthe electronic component 10 a, the adhesive layer may be previouslyprovided on the common substrate 46, or may be provided on a surface ofthe electronic component 10 a that faces the common substrate 46. Then,the electronic component 10 a is fixed by a solidification process suchas heating. Examples of the common substrate 46 include a printedcircuit board and a lead frame.

Next, although not shown, the terminal electrode and a land areconnected to each other via a wire through wire bonding.

Next, as shown in FIG. 2C, a reinforcing plate 28 is fixed on theprotection device 18 of the electronic component 10 a.

In the present preferred embodiment, an adhesive layer 26 is previouslyformed on a surface of the reinforcing plate 28. In this case, it isunnecessary to individually form the adhesive layer 26 on the protectiondevice 18, and thus it is possible to conduct the manufacture by asimpler process. Examples of the combination of the reinforcing plate 28and the adhesive layer 26 include one in which a die attach film isformed on a surface of a Si plate, and one in which an adhesive isscreen-printed on a Si plate. If the reinforcing plate 28 is made of Si,the reinforcing plate 28 has an advantage that the reinforcing plate 28is easily processed and the reinforcing plate 28 is easily thinned.

Then, the reinforcing plate 28 that has been cut into an appropriatesize is mounted on the protection device 18 by using a mounter such thatthe adhesive layer 26 is located between the protection device 18 andthe reinforcing plate 28. Then, the adhesive layer 26 is solidified by asolidification process such as heating, such that the reinforcing plate28 is fixed.

In this process, it is possible to mount the reinforcing plate 28 byusing the mounter that is used when the electronic component 10 a ismounted. In addition, if the electronic component 10 a in which thethickness of the protection device 18 is previously increased isprepared, it is hard to increase the thickness of the photosensitivepolyimide resin, and there is a problem that the cost is furtherincreased. However, in the case of various preferred embodiments of thepresent invention, it is possible to fix the reinforcing plate 28 at alower cost.

Next, as shown in FIG. 3D, the resin layer 48 is formed on the principalsurface of the common substrate 46 on which the electronic component 10a is fixed. At that time, the resin layer 48 is formed so as to containthe electronic component 10 a. Examples of a method for forming theresin layer 48 include laminate and a resin molding method. At thattime, the space 14 is prevented from collapsing due to the presence ofthe reinforcing plate 28.

At the last, although not shown, the common substrate may be divided andindividual electronic component modules may be taken out. In thismanner, the electronic component module is produced.

It should be noted that in the present preferred embodiment, theelectronic component 10 a and the land are connected to each other viathe wire, but may be connected to each other by another connectionmethod such as flip chip bonding.

Second Preferred Embodiment

FIG. 4 is a cross-sectional view showing an electronic component used ina preferred embodiment of the present invention, and is an example wherethe electronic component is a BAW element. A drive device and some ofwires are omitted.

When an electronic component 10 b is a BAW element, an element substrate12 is an insulating substrate of Si or the like, and a drive device 16 bincludes a piezoelectric thin film on both surfaces of which electrodesare located. The drive device 16 b is acoustically isolated from theelement substrate 12 via an acoustic isolation layer. Alternatively, avoid may be formed in the element substrate 12 instead of the acousticisolation layer.

Third Preferred Embodiment

FIG. 5 is a cross-sectional view showing an electronic component used ina preferred embodiment of the present invention, and is an example wherethe electronic component is an MEMS (Micro Electro Mechanical Systems)element. A drive device and some of wires are omitted.

When an electronic component 10 c is an MEMS element, an elementsubstrate 12 is an insulating substrate of Si or the like, and a drivedevice 16 c includes a vibrating device made of Si. Then, the vibratingdevice is formed by MEMS processing.

It should be noted that the present invention is not limited to theabove-described preferred embodiments, and it is possible to makevarious modifications without departing from the gist of the presentinvention.

While preferred embodiments of the present invention have been describedabove, it is to be understood that variations and modifications will beapparent to those skilled in the art without departing from the scopeand spirit of the present invention. The scope of the present invention,therefore, is to be determined solely by the following claims.

1. (canceled)
 2. A method for manufacturing an electronic componentmodule, the method comprising: a step of preparing an electroniccomponent including an element substrate, a drive device formed on aprincipal surface of the element substrate, and a protection devicearranged so as to form a space around the drive device and cover thedrive device; a step of preparing a common substrate, and mounting andfixing the electronic component on the common substrate by using amounter such that a principal surface of the common substrate andanother principal surface of the element substrate face each other; astep of mounting and fixing a reinforcing plate on the protection deviceof the electronic component by using a mounter; and a step of forming aresin layer on the principal surface of the common substrate such thatthe electronic component is contained therein.
 3. The method formanufacturing the electronic component module according to claim 2,wherein, in the step of fixing the reinforcing plate, an adhesive layeris previously formed on a surface of the reinforcing plate, and thereinforcing plate is fixed such that the adhesive layer is locatedbetween the protection device and the reinforcing plate.
 4. The methodfor manufacturing the electronic component module according to claim 2,wherein the reinforcing plate is made of Si.
 5. The method formanufacturing the electronic component module according to claim 3,wherein the reinforcing plate is made of Si.
 6. The method formanufacturing the electronic component module according to claim 2,wherein the element substrate is a piezoelectric substrate and the drivedevice includes an interdigital transducer electrode.
 7. The method formanufacturing the electronic component module according to claim 3,wherein the element substrate is a piezoelectric substrate and the drivedevice includes an interdigital transducer electrode.
 8. The method formanufacturing the electronic component module according to claim 4,wherein the element substrate is a piezoelectric substrate and the drivedevice includes an interdigital transducer electrode.
 9. The method formanufacturing the electronic component module according to claim 5,wherein the element substrate is a piezoelectric substrate and the drivedevice includes an interdigital transducer electrode.
 10. The method formanufacturing the electronic component module according to claim 2,wherein the element substrate is an insulating substrate and the drivedevice includes a piezoelectric thin film on both surfaces on whichelectrodes are formed.
 11. The method for manufacturing the electroniccomponent module according to claim 3, wherein the element substrate isan insulating substrate and the drive device includes a piezoelectricthin film on both surfaces on which electrodes are formed.
 12. Themethod for manufacturing the electronic component module according toclaim 4, wherein the element substrate is an insulating substrate andthe drive device includes a piezoelectric thin film on both surfaces onwhich electrodes are formed.
 13. The method for manufacturing theelectronic component module according to claim 5, wherein the elementsubstrate is an insulating substrate and the drive device includes apiezoelectric thin film on both surfaces on which electrodes are formed.14. The method for manufacturing the electronic component moduleaccording to claim 2, wherein the element substrate is an insulatingsubstrate and the drive device includes a vibrating element made of Si.15. The method for manufacturing the electronic component moduleaccording to claim 3, wherein the element substrate is an insulatingsubstrate and the drive device includes a vibrating element made of Si.16. The method for manufacturing the electronic component moduleaccording to claim 4, wherein the element substrate is an insulatingsubstrate and the drive device includes a vibrating element made of Si.17. The method for manufacturing the electronic component moduleaccording to claim 5, wherein the element substrate is an insulatingsubstrate and the drive device includes a vibrating element made of Si.18. An electronic component module comprising: a common substrate; anelectronic component fixed on the common substrate, the electroniccomponent including an element substrate, a drive device located on aprincipal surface of the element substrate, and a protection devicearranged to define a space around the drive device and to cover thedrive device, the electronic component being mounted and fixed such thata principal surface of the common substrate and another principalsurface of the element substrate face each other; a reinforcing platemounted and fixed on the protection device of the electronic component;and a resin layer arranged on the principal surface of the commonsubstrate so as to contain the electronic component therein.
 19. Theelectronic component module according to claim 18, wherein an adhesivelayer is located on the reinforcing plate and the reinforcing plate isfixed such that the adhesive layer is located between the protectiondevice and the reinforcing plate.